Kartuschenlötspitze für TS8, gerade, messerförmig R0.2, angeschrägt 45°, 8 mm Höhe x 3 mm, 2,91 mm Lot-benetzt beidseitig - Quick TSS08-K03

Soldering a QFP row pin by pin costs time and invites bridges. The TSS08-K03 is dragged instead, its knife shaped blade stands 8 mm high, is 3 mm thick and carries a 45 degree bevel, so solder is carried along the whole edge and released at the end of the row.

What the geometry does

• The 45 degree bevel forms the angled solder pocket that makes drag soldering work in the first place.
• Tinned on both faces over 2.91 mm, so the row can be worked from either side without reversing the tip.
• R0.2 radius on the edge lets the blade settle softly and avoids lifting a trace.
• Height of 8 mm at 3 mm thickness leaves plenty of material behind the edge as heat reserve for long drags across many pins.
• Thermocouple in the tip holds the temperature through the whole drag instead of sagging after the first few pins.
• Chip with the stored calibration value keeps the narrow fine pitch process window repeatable after a change.

Technical data

Application, scope of delivery and compatibility

Intended for drag soldering on QFP and SOIC, for wiping off solder bridges, for header strips with many contacts and for tinning ribbon terminations. When removing solder with wick, the long edge also spreads heat across several pads at once. Supplied as a single cartridge tip without an iron, for the QUELKTSS80A iron of the QUICK TS8 and TS8+ stations.