Hot air station 600 W, 150 to 475 °C, 2 to 20 l/min - Reeco RE-RA150E

SMD parts come off without contact when temperature and airflow match. Too much air blows small parts off the board, too little extends dwell time on the joint. The RA-150E controls both separately and shows the values on the display.

Temperature runs from 150 to 475 °C and airflow from 2 to 20 l/min, set in steps of 1 °C and 1 l/min. Control holds temperature to ±2 °C, so a working point once found can be repeated. After switch-off the heating element cools down on its own.

Nozzle changes need no tools. The supplied adapter takes the square RE-BN BGA nozzles and the round universal nozzles. For larger assemblies the station can be paired with a preheater such as the RE-IR-860 or RE-PHA3.

Benefits

• 600 W heating power, temperature 150 to 475 °C
• Airflow 2 to 20 l/min, set independently of temperature
• Control accuracy ±2 °C for repeatable working points
• Temperature and airflow shown during operation
• Fast nozzle change, compatible with the RE-BN nozzles
• Automatic cool-down of the heating element
• Compact at 240 x 190 x 125 mm and 3.3 kg

Applications

Fitting and removing CHIP, SO, QFP, PLCC and selected BGA components, repair and rework, small series in production, workshop and laboratory.

Accessories

RE-BN series BGA nozzles, universal nozzles, RE-IR-860, RE-PHA3 and RE-QPHA3 preheaters.