Hot air nozzle square 25 x 25 mm for HCT-1000 - Oki HN-B2525

Mid-size BGA and QFP packages are among the most frequent rework cases and the nozzle has to enclose the part completely. The Oki HN-B2525 is a square hot air nozzle with a 25 x 25 mm inner size for the HCT-1000 series convection tools and the modular MRS-1000A rework system.

Benefits

• Square inner size of 25 x 25 mm for components up to roughly 23 x 23 mm edge length
• Hot air guided all around the package so every joint reflows evenly
• Concentrates heat on the target component and spares its neighbours
• Tool-free nozzle change on the HCT-1000 hand piece
• Part of the graduated Oki nozzle programme for MRS-1000A and HCT-1000

Technical data

Applications

Removal and reflow of BGA, CSP, QFP, LGA, PLCC and SOIC packages in repair, rework and failure analysis on populated boards.

Compatibility and scope of delivery

Compatible with the Oki HCT-1000 convection tools and the MRS-1000A rework system. Scope of delivery: one HN-B2525 hot air nozzle. Manufacturer note: the inner dimensions of the nozzles are about 2 mm larger than the stated component size, larger nozzles heat the component more evenly.