Desoldering tip 0.8 mm inside diameter - Thermaltronics T75DT003

When clearing a plated through hole, the ratio between lead diameter and tip bore decides the result. At 0.8 mm inside diameter this T-series desoldering tip closes tightly around thin component leads, so the vacuum of the gun pulls the solder out of the barrel in one pass.

Benefits

• 0.8 mm bore suited to resistors, diodes and IC sockets with fine leads
• Narrow bore keeps airflow velocity high and empties the via in a single action
• 13 mm tip length for compact work on densely populated boards
• Curie controlled 350-398 °C, no overshoot when the tip touches down
• Lead-free and RoHS compliant

Technical data

Applications

Removing through hole parts from double sided and multilayer boards, clearing vias before refitting, repair work on sockets and pin headers with slim pins.

Compatibility and scope of delivery

For the DS-GUN-2 desoldering gun used with Thermaltronics TMT-5000S-1 and TMT-5000S-2 stations. One desoldering tip is supplied.