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Hoof soldering tip 60° for drag soldering and joints that need plenty of solder, SM series - Thermaltronics SM75DS529
Hoof-shaped soldering tip with a 60° bevel from the Thermaltronics SM series. The angled face carries a solder reservoir, ideal for drag soldering along pin rows and for removing solder bridges.
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- Technical questions clarified with the manufacturer
Description
Fine-pitch ICs with many leads are soldered faster when the tip carries a solder reservoir. The SM75DS529 has a hoof shape with a 60° bevel whose face picks up solder and releases it as it is drawn along the pin row.
Benefits in use
- Hoof shape with a 60° bevel: the angled face holds a solder reservoir and releases it evenly.
- Suited to dragging along pin rows (drag soldering) and removing bridges.
- The large contact face transfers heat well to pads and leads.
Applications
SMD assemblies with QFP and SOIC packages, bridge removal, rework on connectors and joints that need more solder.
Care
Keep the tip tinned when parking it and clean it with a sulphur-free sponge or brass wool. This preserves wettability and extends tip life.
Technical data
| Manufacturer | Thermaltronics |
|---|---|
| Tip series | SM |
| Tip shape | hoof, 60° |
| Sales unit | 1 piece |
| Weight | 0.018 kg |
| Manufacturer Nr. | SM75DS529 |
| HS-Code | 85159080 |
| GPSR manufacturer information | AMS Ltd, Unit 3 Norse Trade Park, Congleton CW12 1GW, www.ams-electronics.co.uk |
| Condition of article | New |
| Article authenticity | Original product |
| Country of Manufacture | China |
Scope of delivery
One SM75DS529 soldering tip.
Downloads
Accessories
Sulfide-free cleaning sponge yellow, pack of 10 - Thermaltronics SPG-10
Item WL37519Questions about this item
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