Thermaltronics
Hot air nozzle for BGA, 13 x 13 mm, 22 mm connection - Thermaltronics HTN-B1313
Item WL60044
€43.20
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Hot air nozzle for BGA, 10 x 10 mm, 22 mm connection - Thermaltronics HTN-B1010
BGA hot air nozzle from the Thermaltronics HTN series with a 10 x 10 mm opening. It directs hot air onto a component of this size and protects the surrounding area. Fits hot air tools with the standard 22 mm connection.
- Specialist dealer since 2009
- Invoice payment for regular customers
- Worldwide shipping
- Technical questions clarified with the manufacturer
Description
When soldering or removing BGAs, the heat should stay on the component, not spread over the whole board. The HTN-B1010 with its 10 x 10 mm opening guides the airflow onto exactly that area.
Benefits
- Opening 10 x 10 mm: matched to BGA packages of this size.
- Standard 22 mm connection: for hot air tools with a 22 mm (0.87 inch) connection diameter.
- HTN series: high performance and good durability in continuous use.
- Targeted heat: less thermal stress on neighbouring components.
Applications
- Soldering and desoldering BGA components
- Rework and repair of assemblies
- Rework in electronics production
Technical data
| Type | BGA hot air nozzle |
|---|---|
| Series | HTN |
| Length | 10 mm |
| Width | 10 mm |
| Connection diameter | 22 mm (0.87 inch) |
| Colour | silver |
| ESD safe | no |
| Sales unit | 1 piece |
| Content unit | 1 piece |
| Weight | 0.06 kg |
| Manufacturer | Thermaltronics |
| Manufacturer Nr. | HTN-B1010 |
| HS-Code | 85159080 |
| GPSR manufacturer information | Thermaltronics, Castle Peak Road. 489491, HKG-999077 Sham Shui Po, www.thermaltronics.com |
| Condition of article | New |
| Article authenticity | Original product |
| Country of Manufacture | China |
Downloads
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Questions about this item
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