Hot air nozzle for BGA, 13 x 13 mm, 22 mm connection - Thermaltronics HTN-B1313

When soldering or removing BGAs, the heat should stay on the component, not spread over the whole board. The HTN-B1313 with its 13 x 13 mm opening guides the airflow onto exactly that area.

Benefits

• Opening 13 x 13 mm: matched to BGA packages of this size.
• Standard 22 mm connection: for hot air tools with a 22 mm (0.87 inch) connection diameter.
• HTN series: high performance and good durability in continuous use.
• Targeted heat: less thermal stress on neighbouring components.

Applications

• Soldering and desoldering BGA components
• Rework and repair of assemblies
• Rework in electronics production