Square BGA hot air nozzle 16 x 16 mm for 22 mm connection, HTN series - Thermaltronics HTN-B1616

In BGA rework the nozzle size decides whether heat reaches the right spot. The Thermaltronics HTN-B1616 has a square 16 x 16 mm outlet that covers packages of this size evenly without heating the surrounding board more than necessary.

Benefits

• Even heating: the square 16 x 16 mm outlet matches the footprint of the package.
• Less rework on adjacent parts because the airflow stays on the package area.
• Standard fit: 22 mm (0.87 in) connection diameter for hot air tools with this mount.
• High durability, built for repeated use in repair work.

Applications

Removing and soldering BGA packages in PCB repair, reballing preparation and prototyping. The HTN series is available in further square sizes for other package dimensions.

Compatibility and scope of delivery

Suitable for hot air tools with a 22 mm connection diameter. Check the nozzle mount of your tool before ordering. Supplied: 1 hot air nozzle HTN-B1616.