Entlötlitze 4,9 mm breit, 1,5 m lang auf Antistatikspule - Ersa WICK4.9-1.5

Once a BGA is off the board, the residual solder has to come off the lands before anything can be placed again. The Ersa WICK4.9-1.5 draws it out of the pad by capillary action, and at 4.9 mm wide one pass covers a full row of lands instead of single joints.

What the braid does

• 4.9 mm working width, made for sweeping BGA land areas rather than reworking pad by pad.
• 1.5 m per spool, enough braid for a long run of repairs.
• Fine weave with high capillarity, so solder is taken up quickly and contact time on the pad stays short.
• No clean flux, which normally removes the cleaning step after desoldering.
• Antistatic spool, ready for the ESD bench without repacking.
• RoHS compliant, usable in lead free production without extra clearance.

Technical data

Application, scope of delivery and compatibility

Intended for rework on populated boards, for stripping residual solder from SMD and THT pads and for preparing BGA lands before reballing. The 4.9 mm width works best together with wick-tip shaped soldering tips such as 0102ZDLF200 or 0612ZD, because the tip feeds heat across the full width of the weave. Supplied as one antistatic spool holding 1.5 m of braid.