MiniTweez Removal Tip 6 mm for Chip, SOT, SOIC and D-Pak, for MT-200 - PACE 1130-1005

Short SOIC, SOT packages and D-Paks have terminations on two opposite sides. With a 6 mm blade width the MT-200 tips cover both sides along their full length, reflow every joint at once and lift the part off.

Benefits

• 6 mm blade fully covers both lead rows of short packages
• Both tips heat the opposite terminations at the same time, the part is lifted in the same grip
• No switching between iron and tweezers, shorter heat exposure for the board

Specifications

Applications

• Swapping SOIC-8 and SOT devices
• Removing D-Pak power semiconductors
• Repair of power supply and driver stages

Compatibility

• PACE MT-200 MiniTweez thermal tweezers