MiniTweez Removal Tip 13 mm for SOT, D-Pak, SOIC and TSOP, for MT-200 - PACE 1130-1008

Long SOIC packages and wider TSOPs need blades that span the full lead row. The 13 mm MT-200 tips enclose such parts completely and reflow both sides evenly rather than lifting the part from one side.

Benefits

• 13 mm blade spans long SOIC packages end to end
• Both tips heat the opposite terminations at the same time, the part is lifted in the same grip
• No switching between iron and tweezers, shorter heat exposure for the board

Specifications

Applications

• Removing SOIC-20/24 and wide TSOP packages
• Swapping interface and driver ICs
• Rework on communication and control boards

Compatibility

• PACE MT-200 MiniTweez thermal tweezers