MiniTweez Removal Tip for D-Pak, SOIC, SOT and TSOP, for MT-200 - PACE 1130-1006

Dual-row packages such as SOIC, TSOP and D-Pak come off cleanly with thermal tweezers when both blades meet the lead rows at the same time. This MT-200 tip is designed for exactly these packages and fills the gap between the 6 mm and 10 mm versions.

Benefits

• Two blades catch both lead rows of dual-row packages at once
• Both tips heat the opposite terminations at the same time, the part is lifted in the same grip
• No switching between iron and tweezers, shorter heat exposure for the board

Specifications

Applications

• Removing SOIC and TSOP memory devices
• Swapping D-Pak regulators and MOSFETs
• Repair of control and drive electronics

Compatibility

• PACE MT-200 MiniTweez thermal tweezers