BGA Hot Air Nozzle 29.3 x 29.3 mm for BGA 256, for ST 300/325/350 - PACE 4028-5027

Large-format BGAs do not tolerate one-sided heating. The PACE 4028-5027 encloses a 29.3 x 29.3 mm field so the heat reaches every ball row under the package at the same time. Its designation assigns it to BGA 256 packages.

Benefits

• Large 29.3 x 29.3 mm field: heat spreads across the whole component area, so centre and edge balls reflow together.
• For large boards the ST 325 can be combined with PACE preheaters such as PH 100, ST 400 or ST 1600, which warm the board from below.
• Airflow on the ST 325 adjustable from 5 to 22 slpm, so the flow through the nozzle can be matched to part and board.

Specifications

Applications

• Removing and installing large-area BGA packages
• Rework on large multilayer boards, ideally with a preheater

Compatibility

• PACE ST 300
• PACE ST 325 (8007-0429)
• PACE ST 350