ThermoFlo BGA Nozzle 26 x 26 mm for Components up to 23 x 23 mm, TF 1700/TF 2700 - PACE 4038-7009

Beyond about 20 mm edge length, the heat a BGA absorbs before it reflows rises noticeably. The 26 x 26 mm nozzle delivers hot gas across the full area of a package up to 23 x 23 mm, so the outer balls do not lag behind the centre.

Benefits

• 26 x 26 mm nozzle for components up to 23 x 23 mm.
• Even heat input right out to the edge rows of the ball array.
• Genuine nozzle from the PACE ThermoFlo Nozzle Chart for TF 1700 and TF 2700.

Specifications

Applications

• Rework of chipsets, FPGAs and processors up to 23 x 23 mm
• Removal for failure analysis on boards with large BGAs