ThermoFlo BGA Nozzle 38 x 38 mm for Components up to 35 x 35 mm, TF 1700/TF 2700 - PACE 4038-7011

A 35 mm BGA carries a large thermal mass and often sits on thick multilayer boards. The 38 x 38 mm nozzle spreads the hot gas flow over the full package area, so all solder balls melt within the same profile and the part can be lifted without force.

Benefits

• 38 x 38 mm nozzle for components up to 35 x 35 mm.
• Area heating of large packages, all solder balls melt within the same profile.
• Genuine nozzle from the PACE ThermoFlo Nozzle Chart for TF 1700 and TF 2700.

Specifications

Applications

• Rework of large FPGAs, ASICs and processors up to 35 x 35 mm
• Repair of server, telecom and industrial assemblies