ThermoFlo BGA Nozzle 30 x 30 mm for Components up to 27 x 27 mm, TF 1700/TF 2700 - PACE 4038-7010

The 27 mm format is widespread for processors, graphics and network chips, so it shows up on the rework bench often. The 30 x 30 mm nozzle is matched to exactly this size and keeps the hot gas flow on the package instead of heating the surrounding assembly.

Benefits

• 30 x 30 mm nozzle for components up to 27 x 27 mm.
• Limits heat input to the package, surrounding parts stay below reflow temperature.
• Genuine nozzle from the PACE ThermoFlo Nozzle Chart for TF 1700 and TF 2700.

Specifications

Applications

• Replacing processors, graphics and network chips up to 27 x 27 mm
• Repair of mainboards and industrial controllers