ThermoFlo BGA Nozzle 53 x 53 mm for Components up to 50 x 50 mm, TF 1700/TF 2700 - PACE 4038-7022

50 mm packages, such as large server processors, sockets or network ASICs, can only be reflowed reliably with a nozzle that covers the complete area. The 53 x 53 mm nozzle encloses components up to 50 x 50 mm and carries the hot gas out to the outermost ball rows.

Benefits

• 53 x 53 mm nozzle for components up to 50 x 50 mm.
• Covers the full area of very large packages, no cold corners.
• Genuine nozzle from the PACE ThermoFlo Nozzle Chart for TF 1700 and TF 2700.

Specifications

Applications

• Rework of large-area BGA, LGA and sockets up to 50 x 50 mm
• Repair of server and network assemblies