ST 350E BGA Rework System with Convective Hot Air - PACE 8007-0438

Ball grid arrays need even heating across the entire package. The ST 350E works with convective hot air, shapes the air stream with interchangeable 4028 nozzles and holds the PCB in a dedicated board holder with rail and holder fingers.

Benefits

• Convective hot air for uniform reflow under the whole package.
• Nozzles and replacement heaters shared with the ST 300 and ST 325, which simplifies spare parts.
• Optional ST325/ST350 software for profile management.

Specifications

Applications

• Removing and installing BGA, CSP and large SMD packages
• Rework of populated PCBs in production and repair