7610 Reworksystem 2400 Watt - Quick QU7610

Anyone swapping BGA and QFN packages in a repair shop fights the temperature gap between the package and the board. The 7610 preheats the assembly from below with 1600 W across 260 x 260 mm and applies 720 W from above onto a 60 x 60 mm window, which keeps that gap small.

Features

• Medium wave infrared emitters instead of hot air, no nozzles required and no airflow that shifts parts
• Non contact infrared sensor covering 0 to 300 °C, closed loop control follows the selected profile
• Ceramic elements below at 1600 W, infrared coils above at 720 W, 2400 W connected load in total
• Rigid board holder moving in the X and Y axis, the assembly is aligned under the emitter
• Profiles are selected and edited at the machine or through the supplied Windows software over RS232
• Takes boards up to 420 x 500 mm with components up to 60 x 60 mm

Specifications

Where it is used

Repair shops, test departments and short runs with recurring BGA, QFN and connector work that has to run against a documented temperature profile. Sensor range and profile control make the process traceable.

Compatibility

Works without nozzles and without package specific tooling, the only limits are the 420 x 500 mm board and the 60 x 60 mm component.