Kartuschenlötspitze für TS8, gerade, angeschrägt mit Hohlkehle 45°, Ø 3 mm, Stirn Lot-benetzt - Quick TSS08-3CM

When dragging along SOIC rows and headers, a small solder reservoir often lasts only a few leads. The TSS08-3CM enlarges the hollow to a 3 mm face with a 45 degree grind, so longer sections can be pulled in one pass without reloading halfway.

Operating benefits

• Concave face at 3 mm diameter, the reservoir is clearly larger than on the 2 mm version and carries across more leads.
• 45 degree grind for a flat iron angle close to the board, also next to taller components.
• Face pre-tinned from the factory, the hollow picks up solder from the first contact.
• Solid 3 mm body stores heat, so pads on ground planes do not force a higher station setting.
• Thermocouple inside the tip, correction starts on touch down instead of after the joint.
• Calibration chip in the cartridge, every tip brings its verified value to the station.

Technical data

Application, scope of delivery and compatibility

For drag soldering on SOIC, SOP and medium pitch headers, and for rework where a whole row is rewetted in one pass. Scope of delivery, one cartridge soldering tip. It works in the QUELKTSS80A handpiece of the Quick TS8 and TS8+ stations and interchanges within the TSS08R series with the 2 mm and 4 mm versions of the same shape.