Modular rework system with HCT-1000 and PCT-1000 pre-heater up to 450 °C - Oki MRS-1100A

Replacing a BGA or CSP on a multilayer board calls for controlled pre-heating and a profiled top-side heat input, otherwise delamination and cold joints follow. The Oki MRS-1100A combines the programmable HCT-1000 convection tool with the PCT-1000 pre-heater into one integrated rework system.

Benefits

• Integrated convection rework system for removal and reflow of BGA, CSP and SMT components
• Programmable with digital display and program memory for up to 50 profiles
• Choice of fixed temperature profiling or four-zone programming option
• Temperature control via heating output internally or measured on the board externally
• Various board holders and accessories so different board sizes can be processed

Applications

Component replacement and repair on populated boards in electronics manufacturing, service, laboratory and failure analysis. Suited to BGA, CSP and common SMT packages, including thermally demanding multilayer assemblies.

Compatibility and scope of delivery

The delivery comprises the HCT-1000 convection tool, the PCT-1000 pre-heater, the ATH-1100A adjustable tool holder and the BH-2000 board holder. HN-B series hot air nozzles for the HCT-1000 are selected separately to match the component size, further board holders are available as accessories.