Soldering tip hoof with dent 60° 3.1 mm T series - Thermaltronics T60WV031

Drag soldering whole lead rows on SOIC packages or connectors costs time when the solder reservoir runs dry after every few pins. The T60WV031 answers that with 3.1 mm tip width, a 60° face and 16.4 mm tip length, carrying more solder and transferring more heat per pass.

Benefits

• 3.1 mm hoof face with dent for a larger solder reservoir per pass
• Steeper 60° face for a flat approach angle and solid contact along the lead row
• 16.4 mm tip length reaches recessed joints
• Stable Curie point temperature of 325-358 °C
• Lead-free and RoHS compliant

Applications

Drag soldering wide lead rows, soldering connectors and shield plates, reworking pads with a higher heat demand and tinning stranded wire or contact areas.

Compatibility and scope of delivery

For the SHP-T handpiece and the TMT-5000S-1 and TMT-5000S-2 stations. Delivery consists of a single tip cartridge.