Soldering tip hoof 45° 2.0 mm with solder well - Thermaltronics T70WV020

When drag soldering QFP and SOIC leads, the amount of solder carried by the tip decides how clean the fillet turns out. This hoof-shaped Thermaltronics T-series tip carries a dent in its 2.0 mm working face and is bevelled at 45°, which brings the face flat onto the lead row.

Benefits

• Dent holds a defined solder reservoir and releases it evenly along the drag
• 2.0 mm working width suited to fine pitch leads and dense pin rows
• 45° bevel for a flat approach and a clear view of the joint being formed
• 13 mm tip length, short thermal path and quick recovery to temperature
• 350-398 °C Curie plateau, lead-free and RoHS compliant

Applications

Drag soldering QFP and SOIC packages, touching up lead rows after reflow, hand soldering close pitch headers. The solder well also helps when topping up individual joints.

Compatibility and scope of delivery

For the SHP-T hand piece of the Thermaltronics TMT-5000S-1 and TMT-5000S-2 stations. One tip is supplied.