Soldering tip hoof with dent 45° 2.0 mm T series - Thermaltronics T80WV020

When dragging along a lead row, tip geometry decides how much solder travels with the tip and how much stays behind as a bridge. The hoof form with a dent, ground at 45°, holds a defined amount of solder and releases it in a controlled way across a 2.0 mm face.

Benefits

• The dent in the hoof retains molten solder at the tip and cuts down bridging during drag soldering
• 2.0 mm working face on a 13 mm tip stays visible even in densely populated areas
• Curie point technology without sensor or controller, working band 420-475 °C
• High thermal output for lead-free alloys and demanding joints
• RoHS compliant

Applications

Drag soldering QFP and SOIC lead rows, rework on fine pitch parts, placing and correcting individual joints in prototype work.

Compatibility and scope of delivery

For the SHP-T hand piece of the TMT-5000S-1 and TMT-5000S-2 soldering systems. One tip cartridge is supplied, hand piece and power unit are ordered separately.