Soldering tip hoof with dent 60° 3.1 mm T series - Thermaltronics T80WV031

On ground planes and wide pads a narrow tip loses temperature before the solder flows through. The dented hoof form with a 3.1 mm face and a 60° grind offers more contact area and a larger solder reservoir on a 16.4 mm tip.

Benefits

• 3.1 mm face transfers noticeably more power than the 2 mm version of the same shape
• The dent carries molten solder along and makes dragging over coarser lead rows cleaner
• 60° grind puts the full face on the pad with a steeper hand position
• Self regulating in the 420-475 °C band, no calibration and no temperature controller needed
• RoHS compliant and suitable for lead-free alloys

Applications

Soldering to ground planes and power pads, drag soldering coarser lead rows, attaching stranded wire and connector tabs on populated assemblies.

Compatibility and scope of delivery

Suitable for the SHP-T hand piece on TMT-5000S-1 and TMT-5000S-2. Scope of delivery is one tip cartridge.