Soldering tip hoof 60° 3.3 mm T series - Thermaltronics TM80DS525

When drag soldering QFP and SOIC parts the tip geometry decides whether bridges form. The hoof shaped TM80DS525 carries a defined amount of solder in its 3.3 mm wide, 60° ground well and releases it evenly along the lead row.

Benefits

• Hoof geometry with a concave face that holds a solder reservoir for an even fillet
• Working width 3.3 mm (0.13 in) with a 60° grind, matched to multi-lead SMD packages
• Tip length 17.9 mm (0.70 in) leaves a clear view of the lead row during the drag
• Curie controlled T series, steady 420-475 °C with no calibration step
• RoHS compliant and suitable for lead-free paste and cored wire

Applications

Drag soldering of QFP, TQFP and SOIC devices, filling whole lead rows after placement, clearing solder bridges by picking up the excess and rework on connectors with many contacts.

Compatibility and scope of delivery

The cartridge works in the SHP-T hand piece on the TMT-5000S-1 and TMT-5000S-2 soldering stations. One tip is supplied per order unit.