IR preheater 850 W heating area 200 x 250 mm - Thermaltronics TMT-PH300

Without preheating, the heat from the iron disappears into the copper layers instead of into the joint. The Thermaltronics TMT-PH300 is an 850 W infrared preheater that raises the assembly to a defined temperature from below before soldering or desoldering begins.

Benefits

• Infrared heating area of 200 x 250 mm for medium-sized assemblies
• Temperature range of 50-400 °C in three heating stages under microprocessor control
• Two external sensors read the temperature at the board itself rather than only inside the unit
• Board holder with three-dimensional adjustment for clamping different formats safely
• Mains connection 220-240 V AC with a 250 V 8 A fuse

Technical data

Applications

Preheating multilayer boards before lifting BGA, QFN and large connectors, even warm-up when repairing assemblies with wide ground planes, and reducing delamination or pad lifting where a board is reworked several times.

Compatibility and scope of delivery

The preheater works independently of the soldering or hot air station in use and complements rework benches built around hot air units such as the TMT-HA300. The delivery includes the TMT-PH300 IR preheater and PH-KTC-1 type K thermocouples in a pack of 2.