Thermal paste silicone free 7 g syringe -15 to 200 °C - Chemtronics CW7270

When a power device runs hot, the culprit is usually the air gap between the component and the heat sink. Chemtronics CW7270 fills that gap with a silicone-free thermal paste that stays stable from -15 °C to 200 °C and exceeds the MIL-C-47113 requirement for thermal conductivity.

Benefits

• Silicone free, so no silicone migration onto contact pads, connectors or later solder joints
• Temperature stable from -15 °C to 200 °C, suitable for continuously warm power assemblies
• Exceeds MIL-C-47113 for thermal conductivity
• 7 g syringe for metered, clean application without extra tooling
• Paste consistency fills the micro-roughness of heat sink and component case

Technical data

Applications

Mounting heat sinks on processors, voltage regulators, MOSFETs and power diodes. Typical use is board-level repair, prototype work, control cabinet and drive technology, and any process where silicone must be excluded, for example next to coating or soldering operations.

Compatibility and scope of delivery

Suitable for all common heat sink, housing and semiconductor materials such as aluminium, copper, nickel-plated surfaces and plastic packages. Delivery comprises one syringe holding 7 g of thermal paste, sold as an order unit of 1 piece.

Note: the paste is not declared ESD safe. When working on electrostatic sensitive devices, handle it at a workstation set up in accordance with IEC 61340-5-1.