ESD Desoldering Braid No-Clean 0.8 mm x 1.5 m, Halide-Free Flux, White Bobbin - Chemtronics SW60-1-5

Remove solder cleanly from pads and through-holes without washing the assembly afterwards. Soder-Wick No Clean SD in 0.8 mm width uses an organic, halide-free flux whose residues are non-corrosive. At only 0.8 mm wide it reaches fine SMD pads and tight pin pitches without melting neighbouring joints.

Benefits in use

• Fine braid of oxygen-free pure copper transfers heat quickly and wicks solder at lower tip temperatures, protecting heat-sensitive parts and the PCB.
• Halide-free no-clean flux with surface insulation resistance proven to Bellcore TR-NWT-000078 and ANSI IPC SF-818.
• Static dissipative bobbin, so the braid can be stored and used inside the EPA without extra packaging.
• According to the manufacturer, desolders up to 40 % faster than comparable no-clean braids.
• 0.8 mm width (size 1, white colour code) for quick identification at the bench.

Applications

Repair and rework of SMD and THT assemblies, removing solder bridges, cleaning pads before re-placement, service and lab work.

Handling

Place the braid on the joint, press it down with a clean, tinned tip and lift both together once the solder is absorbed. Cut off the used section.