Düse für HR550, Durchmesser 10,0mm, Silikonsauger 8,0mm integriert - Ersa 0HR5520-80100

A large BGA has to be held securely on pick-up and guided precisely on placement. This HR 550 nozzle uses a 10.0 mm diameter with an integrated 8.0 mm silicone cup that seals against the package surface.

Features

• Integrated silicone cup of 8.0 mm, it seals on uneven package tops and holds the part while the head travels.
• Nozzle diameter 10.0 mm, sized for large BGA and QFP packages rather than single chips.
• Soft sealing face that grips painted or printed packages without leaving a mark.
• Fitted directly to the HR 550 vacuum pipette, so pick-up, alignment and placement run through one head.
• The cup is a wear part and can be replaced separately, the nozzle body stays in service.

Application

For desoldering and replacing large packages in repair, prototyping and failure analysis. Smaller parts are handled with nozzle 0HR5520-35050 at 5.0 mm or 0HR5520-20033 at 3.3 mm, and metal nozzles such as 0HR5520-05010 cover packages below 1 mm.