Did you know? 217 °C

SAC305 is 96.5 percent tin, 3 percent silver and 0.5 percent copper. It melts around 217 degrees Celsius, some 34 degrees above the old eutectic tin lead alloy.

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Desoldering tips C360

Desoldering tips

JBC C360 desoldering nozzles are designed for the DS360-A desoldering station and comprise two functional groups: throughhole desoldering nozzles (C360001-C360007) with bore diameters from 0.6 mm to 1.5 mm for extracting solder from PTH holes, and pad-cleaning nozzles (C360011-C360014) from 0.6 mm to 1.2 mm for post-desoldering pad preparation. All nozzles are form-fit for the DS360-A and allow tool-free tip exchange at the workstation.

Model	Type	Bore
C360001	Throughhole desoldering	0.6 mm
C360002	Throughhole desoldering	0.8 mm
C360003	Throughhole desoldering	1.0 mm
C360004	Throughhole desoldering	1.2 mm
C360007	Throughhole desoldering	1.4 mm
C360006	Throughhole desoldering	1.5 mm
C360011	Pad cleaning nozzle	0.6 mm
C360012	Pad cleaning nozzle	0.8 mm
C360013	Pad cleaning nozzle	1.0 mm
C360014	Pad cleaning nozzle	1.2 mm

⚙ Bore range 0.6-1.5 mm - covers standard PTH drill grids per IPC-2221

✓ Pad-cleaning nozzles C360011-C360014 - remove solder residue after desoldering without damaging the copper pad surface

⚡ Tool-free nozzle change - DS360-A form-fit mount enables rapid swap during continuous operation

🛠 DS360-A compatible - JBC cartridge heating concept, precise temperature control at the nozzle tip

Typical applications: Desoldering through-hole components from PTH holes on single and multilayer boards per IPC-7711, repair of connectors and relays, removal of DIP ICs, and pad cleaning after desoldering before re-population per IPC-7721 Class 3.

What are JBC C360 desoldering nozzles and what industrial applications do they serve?

JBC C360 desoldering nozzles are precision-engineered vacuum extraction tips designed specifically for the DS360-A desoldering station, serving electronics manufacturing, PCB rework, and component recovery operations. These nozzles enable controlled removal of through-hole components and surface-mount devices while protecting adjacent circuit elements from thermal damage. Primary applications include aerospace electronics repair, automotive ECU refurbishment, medical device servicing, and high-reliability electronics manufacturing where component salvage and board integrity are critical requirements for maintaining operational standards and regulatory compliance.

What are the key technical selection criteria for JBC C360 desoldering nozzles?

Selection of JBC C360 desoldering nozzles depends primarily on component lead diameter and application type, with available inner diameters ranging from 0.6mm to 1.5mm across the product line. Through-hole variants like C360001 through C360007 accommodate standard component leads, while pad cleaning variants C360011 through C360014 target surface-mount rework applications. Critical selection factors include thermal mass matching to prevent overheating, vacuum flow characteristics for efficient solder extraction, and nozzle geometry optimization for specific component packages and board densities encountered in professional electronics assembly operations.

Which international standards apply to JBC C360 desoldering nozzles for professional electronics work?

JBC C360 desoldering nozzles comply with IEC 61340-5-1 standards for electrostatic discharge protection in electronics manufacturing environments, ensuring safe handling of sensitive CMOS and microprocessor components. The nozzles meet ISO 9001 quality management requirements and conform to RoHS directive 2011/65/EU for restricted substance compliance in electronic equipment. Professional electronics rework operations typically require adherence to IPC-7711/7721 standards for electronic assembly rework, repair and modification, which these precision nozzles support through controlled thermal profiles and contamination-free solder removal processes that maintain assembly integrity throughout component extraction procedures.

What are the differences between through-hole and pad cleaning variants of JBC C360 nozzles?

Through-hole C360 variants like C360001 through C360007 feature straight-bore geometry optimized for extracting solder from component leads in plated-through holes, with diameters from 0.6mm to 1.5mm to match standard component specifications. Pad cleaning variants C360011 through C360014 incorporate specialized tip geometry designed for surface-mount component removal and solder pad preparation, typically featuring wider opening angles and modified vacuum characteristics. The pad cleaning series focuses on controlled thermal application for QFP, BGA, and other surface-mount packages while minimizing thermal stress on surrounding components and substrate materials during precision rework operations.

What are the installation and compatibility requirements for JBC C360 desoldering nozzles?

JBC C360 desoldering nozzles are engineered exclusively for the DS360-A desoldering station and feature a proprietary connection interface that ensures proper thermal coupling and vacuum sealing. Installation requires alignment of the nozzle heating element with the station temperature control system, typically achieving operational temperature within 15-20 seconds of activation. The nozzles incorporate integrated temperature sensing for closed-loop control and maintain compatibility with JBC advanced tip recognition system, which automatically adjusts heating profiles based on nozzle thermal characteristics and application requirements for optimal performance across different solder alloy systems and component types.

What are the operating temperature range and safety specifications for JBC C360 nozzles?

JBC C360 desoldering nozzles operate across a temperature range of 200°C to 450°C with precision control within ±5°C, suitable for lead-free and leaded solder systems including SAC305 and SnPb alloys. The nozzles feature ESD-safe construction meeting IEC 61340 standards with surface resistivity specifications preventing electrostatic discharge damage to sensitive components. Thermal isolation design ensures operator safety while maintaining efficient heat transfer to the work area, with integrated temperature sensing providing automatic thermal protection against overheating conditions that could damage both the nozzle and target assemblies during extended operation cycles.

What maintenance schedule and service life expectations apply to JBC C360 desoldering nozzles?

JBC C360 desoldering nozzles typically provide 200-500 hours of operational service life depending on operating temperature, solder alloy types, and flux chemistry exposure in production environments. Regular maintenance includes weekly inspection of nozzle bore diameter for wear or contamination buildup, cleaning with appropriate flux removers, and verification of vacuum seal integrity through flow testing procedures. Replacement indicators include bore diameter expansion beyond 0.1mm of specification, visible oxidation of the heating element, or degraded thermal response characteristics, with proper storage in moisture-controlled environments extending service life significantly beyond standard operational expectations.

Desoldering tips C360

C360 model overview by type and bore

Technical features of the C360 series

Typical applications