Desoldering tips C245

Desoldering tips

JBC SMD desoldering tips C245 for the T245 handpiece comprise 22 variants for the removal of a wide range of SMD package types. Chip desoldering tips are available at 1.9 mm (C245016), 2.2 mm (C245017), 3.4 mm (C245018) and 4.5 mm (C245019). QFP tips cover 8.5x8.5 mm (C245223), 12.4x15 mm (C245228), 15x15 mm (C245315) and 12x12 mm (C245224). Socket tips are available in 11.9x14.5 mm (C245248), 17x17 mm (C245247) and 17.5x17.5 mm (C245227). Tunnel desoldering tips range from 5.4x6 mm (C245220) through 5.4x10 mm (C245221) and 7.1x13 mm (C245222) to the large forms 9.6x18 mm (C245215) and 15.2x29 mm (C245226). A special form for Micro Stick Switch (C245136) rounds out the range.

TypePart no.Size
ChipC2450161.9 mm
ChipC2450172.2 mm
ChipC2450183.4 mm
ChipC2450194.5 mm
QFPC2452238.5x8.5 mm
QFP/PLCCC24522412x12 mm
QFPC24522812.4x15 mm
QFPC24531515x15 mm
Socket/flatC24522717.5x17.5 mm
SocketC24524717x17 mm
SocketC24524811.9x14.5 mm
TunnelC245220 / C2452505.4x6 / 5.4x8 mm
TunnelC245221 / C2453035.4x10 / 6.5x6 mm
TunnelC2452227.1x13 mm
TunnelC2452159.6x18 mm
Tunnel (solder tip)C24522615.2x29 mm

T245 compatibility - all C245 SMD desoldering tips exclusively for the T245 handpiece
22 variants - chip 1.9-4.5 mm, QFP/PLCC up to 17.5x17.5 mm, tunnel up to 15.2x29 mm
Tunnel desoldering - C245215-C245226 for SOIC, SOT and rectangular tunnel packages
C245136 Micro Stick Switch - special form for miniaturised slide switches

Typical applications: Removal of chip SMD components (0402 to 1206 and larger), complete single-operation desoldering of QFP and PLCC packages, tunnel desoldering of SOIC and SOT on populated PCBs with the T245 handpiece, and rework in electronics assembly and after-sales service.

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  1. Desoldering tip tunnel for DIL ICs 5.4 x 8 mm - JBC C245-250
    €59.92