Soldering tip micro fine 0.25 mm T series - Thermaltronics TM70MF375

On 0201 parts, flex connectors and fine pitch BGA rework the tip width decides whether only the intended joint reflows. The TM70MF375 is the micro fine version of the T series, 0.25 mm wide with a compact tip length of 13.4 mm.

Benefits

• Tip width of 0.25 mm for ultra fine pitch and components from 0201 size
• Short 13.4 mm tip length for fast heat recovery despite the fine geometry
• Constant 350-398 °C from Curie point control, no temperature drift
• Lead-free and RoHS compliant for rework on SAC soldered assemblies

Applications

Rework on 0201 and 0402 components, flex connectors and camera modules, correcting individual BGA pads, and prototype work under a stereo microscope.

Compatibility and scope of delivery

Compatible with the SHP-T hand piece of the TMT-5000S-1 and TMT-5000S-2 stations. Scope of delivery is one TM70MF375 cartridge.