Conductive HD Pin-Insertion Foam for Leaded Components, Sheets 1 x 1 m, 6 to 10 mm - Desco

ICs, transistors and other leaded components are most at risk in transit when a voltage can build up between their pins. In conductive pin-insertion foam the leads are pushed in and brought to the same potential, so no discharge can pass through the device. The HD foam has a density of 35 to 55 kg/m³, holds parts firmly and sits in the conductive range with Rs below 1 x 10⁴ ohms. The sheets measure 1 x 1 m, with thickness from 6 to 10 mm chosen to suit the pin length.

Key benefits

• Equipotential bonding: all inserted pins are held at the same potential, protecting the device from discharge.
• High density of 35 to 55 kg/m³: pins stay seated and the part does not shift in transit.
• Conductive with Rs below 1 x 10⁴ ohms, volume resistivity no more than 2.5 x 10² ohm·m.
• Non-corrosive: zinc, nickel and other non-ferrous metals are not attacked even at elevated temperature and humidity, which matters for tinned and nickel-plated leads.
• Ageing resistant: no more than 30 % loss of tensile strength after heat and humidity ageing.

Applications

Storage and shipping of leaded ICs, transistors, connectors and small assemblies, as an insert in conductive boxes, drawers and shipping cartons. For lid cushioning, the softer FX cushioning foam is the better match.

Standards

Meets EN 61340-5-1 and the packaging standard IEC 61340-5-3, resistance tested per IEC 61340-2-3. Under EN 61340-5-2, untreated foams are not permitted as packaging in the EPA.