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Dip Stencil 40 x 40 mm, 150 µm Dip Depth - Ersa 0PR100-D005
Dip stencil for the Ersa Dip & Print Station 0PR100, used to prepare SMD components. In a 40 x 40 mm format it creates a defined solder paste or flux depot with a 150 µm (0.15 mm) dip depth. Ideal for the repeatable wetting of BGA and fine-pitch components before placement during rework.
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Description
The Ersa dip stencil 0PR100-D005 is an accessory for the Ersa Dip & Print Station 0PR100 and is used to apply a defined deposit of solder paste or flux to SMD components. Its etched 150 µm pocket creates a reproducible, accurately dosed depot at the component terminations - ideal for BGA and fine-pitch components prepared before placement during the rework process.
Technical data
| Manufacturer article number | 0PR100-D005 |
|---|---|
| Product type | Dip stencil |
| Format | 40 x 40 mm |
| Dip depth | 150 µm (0.15 mm) |
| Application | Solder paste or flux depot for SMD, BGA and fine-pitch components |
| Compatible system | Ersa Dip & Print Station 0PR100 |
| EAN | 4003008093490 |
| Manufacturer | Ersa GmbH (Kurtz Ersa) |
| Weight | 0.1 kg |
| Manufacturer Nr. | 0PR100-D005 |
| GPSR manufacturer information | Ersa GmbH, Leonhard-Karl-Straße 24, DE-97877 Wertheim, www.kurtzersa.com |
| Condition of article | New |
| Article authenticity | Original product |
| Country of Manufacture | Germany |
| ESD version | TEC |
Downloads
Datasheet
User Manual
Declaration of Conformity
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