MiniTweez Removal Tip 18 mm for SOIC and TSOP, for MT-200 - PACE 1130-1009

TSOP memory and long SOICs with many leads need one continuous heated face along the whole body. The 18 mm blades of the MT-200 bring both lead rows to temperature together, so the part releases without bending its leads.

Benefits

• 18 mm blade handles TSOP and long SOIC in one pass
• Both tips heat the opposite terminations at the same time, the part is lifted in the same grip
• No switching between iron and tweezers, shorter heat exposure for the board

Specifications

Applications

• Swapping TSOP flash and SRAM devices
• Removing long SOIC-28 packages
• Data recovery and memory rework

Compatibility

• PACE MT-200 MiniTweez thermal tweezers