Kartuschenlötspitze für TS8, gerade, angeschrägt mit Hohlkehle 45°, Ø 4 mm, Stirn Lot-benetzt - Quick TSS08-4CM

The longer the lead row, the more often a drag pass has to be reloaded with solder. The TSS08-4CM offers the largest cavity of this shape family, a concave face on a 45 degree bevel of 4 mm diameter, so both reservoir and heat storage grow again over the 3 mm version.

Operating benefits

• 4 mm face, the largest solder reservoir among the concave bevels in this range, for longer sections without reloading.
• 45 degree grind, a flat iron angle close to the board while pulling along the row.
• Solid 4 mm body as thermal storage, so strands and terminals also reach temperature quickly.
• Face pre-tinned from the factory, the hollow picks up solder from the first contact.
• Thermocouple right at the working face because tip and heater form one unit.
• Calibration chip in the cartridge, the station shows the verified value again after a tip change.

Application, scope of delivery and compatibility

Suited to long headers, wide SOIC and SOP rows, wire tinning and joints that need a larger volume of solder in one pass. Scope of delivery, one cartridge soldering tip. It runs in the QUELKTSS80A handpiece on Quick TS8 and TS8+. The same concave bevel is available at 3 mm and 2 mm diameter for finer pitches, all three belong to the TSS08R series.