Square BGA hot air nozzle 37.6 x 37.6 mm for RA-150E and RA-250E - Reeco RE-BN39

A BGA only comes off the board when the heat reaches the package evenly on all sides. The square RE-BN39 nozzle encloses packages with an edge length of up to 37.6 mm and keeps the hot air where it belongs.

The RE-BN series is built for BGA and TQFP packages. The open design rests directly on the printed circuit board, air flows down through shaped channels and travels around the package. The component heats up uniformly while neighbouring parts stay out of the main heat path.

Benefits

• Internal size 37.6 x 37.6 mm, matched to the package
• Open design, the nozzle sits on the board during work
• Even heat distribution across the whole package
• Welded sheet steel, tight and dimensionally stable over many cycles
• Repeatable results in assembly and removal

Applications

Board repair and rework, replacement of BGA, µBGA and TQFP components, small series production and laboratory work.

Compatibility

Reeco RA-150E and RA-250E hot air stations. Handpieces from other manufacturers connect through the RE-ADAPTER nozzle adapter.