Reflow Process Kamera (RPC-Kamera) für HR 550 - Ersa 0HR510

Whether a BGA ball has really melted is something the thermal profile only tells indirectly, because the sensor measures next to the component and not at the joint. The 0HR510 reflow process camera looks under the component with 2.3 megapixels and shows the collapse of the solder balls at the moment it happens. The liquidus phase is then proven by image instead of derived from a curve.

Benefits

• 2.3 MP CMOS colour sensor, so solder balls, wetting and residual solder on the pad stay visible even at fine pitch.
• Fixed 25 mm focal length matched to the working distance under the heating head of the HR systems.
• Two adjustable LED lights, keeping reflective solder surfaces readable without blooming.
• GigE camera on Ethernet, so images reach HRSoft without extra frame grabber hardware.
• Released for HR 500, HR 550 and HR 550 XL, so one camera can serve several systems in house.

Applications

Process release and failure analysis when removing and replacing BGA, QFN and BTC parts. The recording serves as evidence for customers and auditors and supports profile development, because it shows how far the assembly actually is during melting.