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BGA 225 Print Stencil for Dip & Print Station - Ersa 0PR100-S001
Print stencil in the BGA 225 version for the Ersa Dip & Print Station 0PR100. It applies solder paste precisely and reproducibly to the connections of BGA and SMD components for reliable component preparation during rework.
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Description
The Ersa BGA 225 print stencil is a component-specific accessory for the Ersa Dip & Print Station 0PR100. The component is clamped into the stencil and printed with solder paste from below, then lifted out and positioned using the placement unit. This applies solder paste to the connections of BGA and SMD components simply, precisely and reproducibly.
Technical data
| Feature | Value |
|---|---|
| Type | Print stencil |
| Version | BGA 225 |
| Compatible system | Ersa Dip & Print Station 0PR100 |
| Manufacturer part number | 0PR100-S001 |
| EAN | 4003008090857 |
| Weight | 0.1 kg |
| Manufacturer | Ersa |
| Manufacturer Nr. | 0PR100-S001 |
| GPSR manufacturer information | Ersa GmbH, Leonhard-Karl-Straße 24, DE-97877 Wertheim, www.kurtzersa.com |
| Condition of article | New |
| Article authenticity | Original product |
| Country of Manufacture | Germany |
| Ausführung | BGA 25 |
| ESD version | TEC |
| ESD equipment | ESD Lötstationen |
Downloads
Datasheet
User Manual
Declaration of Conformity
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