Automatische Restlotentfernung HR600P - Ersa 0SC600P

Once a BGA has been lifted, residual solder stays on the pads, and this is the step that costs the most time by hand and causes most of the collateral damage to solder mask and tracks. The module takes over residual solder removal with its own Z axis and 375 W of heating power, while the suction height regulates itself through the vacuum.

What sets the module apart

• Dedicated Z axis, so residual solder removal works independently of the heating head kinematics.
• Automatic Z height control by vacuum, the nozzle follows the board plane instead of pressing onto the pads.
• 375 W of heating power at the suction point, which liquefies the residue quickly and keeps local heat input short.
• Suction nozzle of 3 mm outside diameter included, sized for common BGA pad fields.
• Supply and control unit for vacuum, nitrogen and interfaces as part of the module, so system integration is complete.
• Programming through the supplied HRSoft 2 update, the cleaning step lives in the same profile as removal and placement.

Technical data

Application, scope of delivery and prerequisites

The module pays off where BGA repairs occur in series and pad preparation has to be documented repeatably, for example in assembly refurbishment and prototype rework. Included are the removal module with Z axis, the supply and control unit, the HRSoft 2 update, a 3 mm suction nozzle and a maintenance tool with brush and needle. A nitrogen supply at 6 bar, 30 L/min or 1.8 m3/h and purity 5.0 has to be provided on site.