Heizkopf 150×80 - 2000W für 0HR600XL - Ersa 0HR667L

The standard top heater of the HR 600 XL puts 800 W onto 60 x 60 mm. As soon as the component is larger, its edge stays cooler than its centre and the outer solder balls melt late or not at all. This heating head provides 2000 W across a 120 x 80 mm field and splits it into four zones of 500 W, so the temperature field over the component area can be evened out deliberately.

Benefits

• 2000 W instead of 800 W, enough power for components with heavy thermal mass and thick copper layers.
• Four zones of 500 W each, letting the profile compensate for a temperature drop towards the component edge.
• 120 x 80 mm heated field, covering a large BGA or module in one heat up rather than two passes.
• Hybrid technology in the top heater, bringing heat in by radiation and by the gas flow.
• Released for the HR 600 XL, whose 625 x 625 mm bottom heater preheats the board over a wide area.

Applications

Rework on large BGAs, power modules and BTC parts on thick multilayers where the standard head no longer covers the component area. The head replaces the smaller top heater on the HR 600 XL, and profiles have to be developed again for the larger area.