Soldering tips C245
Soldering tips
With 117 variants, the C245 series represents the broadest soldering tip range for the JBC T245 iron. Conical tips span diameters from 0.3 mm (C245030) to 3.5 mm (C245256), while chisel tips range from 1.2x0.7 mm (C245906) to 4.8x1.5 mm (C245908). Dedicated forms for QFP and PLCC assembly are available: C245009 (4.5x1.8 mm QFP) and C245010 (4.5x1.8 mm PLCC). Drag soldering tips C245651 and C245654 allow simultaneous tinning of complete IC lead rows.
The range divides into standard C245 tips and special tips (category 17789). Angled variants such as C245029 (D: 0.4 mm) and C245259 (D: 1.5 mm) are designed for confined component positions. Several tips carry the 800 suffix code (e.g. C245806, C245808), indicating an enhanced surface finish for improved wetting.
| Geometry | Example part | Size | Application |
|---|---|---|---|
| Conical | C245030 / C245036 | D: 0.3 / 0.5 mm | SMD, fine-pitch |
| Conical | C245001 / C245201 | D: 0.6 mm | THT, general |
| Conical bevel | C245256 | D: 3.5 mm | Large pads, power connections |
| Chisel | C245906 / C245806 | 1.2x0.7 mm | SMD pad soldering |
| Chisel | C245908 / C245808 | 4.8x1.5 mm | Power pads |
| Chisel | C245911 | 3.2x1.2 mm | Medium pads |
| QFP | C245009 | 4.5x1.8 mm | QFP assembly |
| PLCC | C245010 | 4.5x1.8 mm | PLCC assembly |
| Drag | C245651 / C245654 | 1.25 mm / 0.75 mm | IC lead rows, SOIC, QFP |
Typical applications: SMD hand soldering from fine-pitch (0.3 mm conical) to power connections (4.8x1.5 mm chisel), QFP and PLCC assembly with form tips, drag soldering on SOIC and QFP packages, THT soldering and rework in production, and laboratory or service environments using the T245 handpiece.
