Center lead offset 2.5 mm forming die TO220 for Supercut/TOCF - Iteco 132100

Many boards do not use a straight in line hole pattern for TO220 devices but move the center lead forward by 2.5 mm. This die assembly produces exactly that offset on the Supercut/TOCF, so no lead has to be bent by hand at the assembly bench.

Operating features

• Defined 2.5 mm offset - the catalogue figure is produced by the die and repeats across the whole batch.
• Wider spacing between leads - the displaced center lead increases the creepage distance to the two outer legs.
• Cut and offset in one stroke - the component leaves the machine fully formed.
• Clamping close to the body - the pneumatic wire holder supports the lead during forming and keeps strain off the package.
• Up to 3000 pieces per hour - the offset costs no cycle time.

Technical data

Applications

Insertion of voltage regulators and power transistors into standard layouts with a staggered center pad, and assemblies with raised dielectric requirements where a larger distance between the leads is specified.

Compatibility and scope of supply

The die works only in the Supercut/TOCF automatic machine, which Iteco supplies under part numbers 7915.176 and 7915.177 in the 115 V and 230 V versions. The machine ships without tooling and every forming shape needs its own die. Each component package additionally requires the matching clamping piece and tube holder. Supplied as one complete die assembly. Made in Italy.