Center lead offset with lock-in die TO218 for Supercut/TOCF - Iteco 132600

Devices in a TO218 package carry more mass than a TO220 and therefore tip out of the hole more easily before soldering. On the Supercut/TOCF this die assembly displaces the center lead and additionally forms a loop that locks the component inside the hole.

Operating features

• Retention for a heavy package - the formed loop holds the TO218 even when the board is moved before soldering.
• Displaced center lead - suits layouts whose middle pad is not aligned with the outer ones.
• Die built for the wide body - seat and forming contour follow TO218 and are not interchangeable with TO220 tooling.
• Less bench work - cut, offset and loop are produced within the same machine stroke.
• Up to 3000 pieces per hour - even the three part operation runs at machine speed.

Technical data

Applications

Power assemblies with TO218 transistors that are transported or turned before wave soldering, and equipment in which the device hangs on its leads alone until it is bolted to the heat sink.

Compatibility and scope of supply

The die works only in the Supercut/TOCF automatic machine, which Iteco supplies under part numbers 7915.176 and 7915.177 in the 115 V and 230 V versions. The machine ships without tooling and every forming shape needs its own die. Each component package additionally requires the matching clamping piece and tube holder. Supplied as one complete die assembly. Made in Italy.