Moisture Barrier Bags
ESD Beutel
Moisture Barrier Bags (MBB) provide multilayer protection against moisture ingress, electrostatic discharge, and mechanical stress during PCB assembly storage and long-distance shipment. Compliant with IEC 61340-5-1 and JEDEC J-STD-033, these bags achieve a water vapor transmission rate (WVTR) of <0.002 g/m²/24h and a surface resistance of 10⁵-10¹¹ Ω - critical parameters for safeguarding moisture-sensitive devices (MSD) at JEDEC levels 1 through 6. The 4-layer laminate construction - polyester / aluminium foil / ESD layer / polyethylene - delivers puncture resistance of >150 g and a seal strength of >1.3 kg/25 mm.
As a specialist distributor for ESD packaging, esd.equipment stocks 95 ready-to-ship Moisture Barrier Bag variants covering a broad size range from small IC pouches to large panel bags. All products meet the requirements of IEC 61340-5-1, JEDEC J-STD-033C, and MIL-PRF-81705 Type I, giving procurement engineers a single qualified source for EPA-compliant packaging across SMT, semiconductor, and aerospace supply chains.
Moisture Barrier Bag - Product Overview
| Feature | Moisture Barrier Bag | Standard ESD Shielding Bag | Anti-Static Poly Bag |
|---|---|---|---|
| Construction | 4-layer PET/Al/ESD/PE | 3-layer metalised film | Single-layer PE |
| WVTR | <0.002 g/m²/24h | ca. 1-3 g/m²/24h | Not rated |
| Surface resistance | 10⁵-10¹¹ Ω | 10⁶-10¹¹ Ω | 10¹² Ω (no shielding) |
| Shielding effectiveness | >60 dB | >40 dB | None |
| Key standard | JEDEC J-STD-033C, MIL-PRF-81705 Type I | IEC 61340-5-1, ANSI/ESD S11.4 | IEC 61340-5-1 (surface only) |
| MSD level coverage | Levels 1-6 | Not rated for MSD | Not rated for MSD |
| Typical application | Long-term storage, ocean/air freight | Short-term in-house transport | Non-critical parts handling |
| Heat-sealable | Yes - impulse or bar sealer | Yes | Yes |
Typical application areas: SMT and PCB assembly storage (IPC-A-610, JEDEC J-STD-033C), semiconductor component packaging for ocean and air freight (SEMI S1/S2, MIL-PRF-81705 Type I), medical device component storage (ISO 13485), automotive electronics supply chain (IATF 16949, VDA 6.3), aerospace and defence hardware packaging (AS9100), BGA and QFP long-term dry storage, reflow-sensitive MSD floor life management.