Soldering tips
Soldering tips ET
The Weller ET series is the tip programme for the LR21 and FE50 soldering irons and, with 28 items, offers the widest shape range of all Weller station tips. Chisel forms run from ET-HL (0.8x0.4 mm) to ET-E (5.6x1.2 mm), complemented by bevelled variants (ET-BB, ET-CC, ET-F), round forms (ET-CS, ET-O, ET-SL), SMD-specific chip tips (ET-SMD-2.5: 2.5x1.5 mm; ET-SMD-3.8: 3.8x1.5 mm), a solder pool tip (ET-GW, D: 6.8 mm), and desoldering tips for DIP packages (DIL 16WG, DIL 16WGEC, DIL E 24). A thermocouple measurement tip (ET, D: 0.5 mm) allows direct temperature monitoring at the tip.
- 26 items
- 1 manufacturer
- Net prices plus VAT
Buying guide
How to choose Soldering tips ET
What matters when choosing: properties, comparison and typical applications.
ET tip shapes and dimensions (selection)
| Model | Shape | Dimension |
|---|---|---|
| ET-HL | Chisel | 0.8 x 0.4 mm |
| ET-A | Chisel/straight | 0.7 x 1.6 mm |
| ET-R | Chisel/straight | 1.6 x 0.7 mm |
| ET-B | Chisel/straight | 2.4 x 0.8 mm |
| ET-C | Chisel/straight | 3.2 x 0.8 mm |
| ET-D | Chisel/straight | 4.6 x 0.8 mm |
| ET-E | Chisel/straight | 5.6 x 1.2 mm |
| ET-SMD-2.5 | Chip | 2.5 x 1.5 mm |
| ET-SMD-3.8 | Chip | 3.8 x 1.5 mm |
| DIL 16WG / 16WGEC | DIP-16 desoldering | 7.62 x 2.54 mm |
| DIL E 24 | DIP-24 desoldering | Pitch 15/24 mm |
Specialist tips and selection notes
Typical applications
Typical applications: Manual SMD soldering with the FE50 using ET-SMD chip tips, through-hole THT assembly with the LR21 using chisel forms ET-A to ET-E, DIP-IC removal without individual-pin desoldering (DIL 16WG), tinning and solder pool operations on test points, and direct joint temperature measurement with the thermocouple tip.